? محول Type-C متعدد المنافذ 11 في 1 – الحل الكامل لمكتبك وسفرك! حوّل منفذ Type-C في حاسوبك إلى مركز اتصال شامل يضم 11 من�

Intel Z390 mATX gaming motherboard with OptiMem II, Aura Sync RGB LED lighting, DDR4 4266+ MHz support, 32Gbps M.2, Intel Optane memory ready, and native USB 3.1 Gen 2. -TUF Protection: S

Nouveau Ce pointeur laser HOCO GM202 est construit avec un matériau de coque ABS. Il dispose d’une connectivité de télécommande sans fil 2,4 GHz qui apporte une performance fluide

Logitech R400 Télécommande de Présentation sans Fil Fiche technique simplifiée : Connexion et utilisation Connexion : Sans fil 2,4 GHz via récepteur USB nano (prêt à l’emploi

Imprimante Transfert thermique Pour etiquettes GODEX EZ120 EQUI G500 Bureautique Tres Robuste Made in taiwan Taille d'impression max 108mm. Ruban 350m. Fiche technique Model EZ120 Print

Caractéristiques · Propre technologie, le firmware peut être mis à niveau en ligne. · Peut lire des codes de barre d'écran tels que les téléphones mobiles et les ordinateurs. · L'

HP DL380 G9 CPU XEON 2X 2609 V3 RAM 32GB PSU 2X 500WATTS HDD 7X 500GB HP ProLiant DL580 Gen7 Traditionally, mission-critical RAS (Reliability, Availability and Serviceability) fe

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2024, September 23 Status Available. Released 2024, October BODY Dimensions 165.7 x 77.1 x 8.1 mm (6.52 x 3.04 x 0.32 in) Weight 184 g (

Network Technology GSM / HSPA / LTE Launch Announced 2024, October 20 Status Available. Released 2024, November Body Dimensions 164.1 x 74.4 x 6.8 mm (6.46 x 2.93 x 0.27 in) Weight 162 g (5

Network Technology GSM / HSPA / LTE Launch Announced 2024, September 23 Status Available. Released 2024, October Body Dimensions 165.7 x 77.1 x 8.4 mm (6.52 x 3.04 x 0.33 in) Weight 188 g (

Network Technology GSM / HSPA / LTE Launch Announced 2024, September 23 Status Available. Released 2024, October Body Dimensions 165.7 x 77.1 x 8.1 mm (6.52 x 3.04 x 0.32 in) Weight 184 g (

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2024, September 23 Status Available. Released 2024, October BODY Dimensions 165.7 x 77.1 x 8.4 mm (6.52 x 3.04 x 0.33 in) Weight 188 g (

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2024, April 04 Status Available. Released 2024, May BODY Dimensions 166.2 x 76.8 x 7.9 mm (6.54 x 3.02 x 0.31 in) Weight 195 g (6.88 oz)

➡️ التوصيل إلى 58 ولاية الدفع عند الإستلام ➡️ Livraison 58 Wilayas Paiement Main à Main ➡️ Possibilité de Facturation Pour Les Entreprises ➡️

Unique Feature Superb Productivity - PCIe Gen5 (Graphics, M.2) - Dual Channel DDR5 Rock-Solid Durability - 12+2+1 Power Phase, Dr.MOS for VCore+SOC+MISC with Enlarged Heatsink Armor - Flexib

CPU AMD Socket AM5, support for: AMD Ryzen™ 7000 / Ryzen™ 8000 / Ryzen™ 9000 Series Processors (Please refer "CPU Support List" for more information.) Chipset AMD B650 Memory Support f

Processeur AMD Socket AM5, support for: AMD Ryzen™ 7000 / Ryzen™ 8000 / Ryzen™ 9000 Series Processors (Go to GIGABYTE's website for the latest CPU support list.) Chipset AMD B650 Mémo

Borrego T7 Smart WIFI Projector Model: T7Input: AV, USB, HDMI Video Format Résolution: 720P (1280x720) BrightNess (lm): 3800Image System: L Contrast Ratio: 1000:1 Picture Size (inch): 40-20

CARACTÉRISTIQUES 1. Design cool breveté, entièrement fabriqué en métal, cercle de support LED dans une couleur personnalisée. 2. Un bouton, prend en charge le contrôle du volume et l

Processeur AMD Socket AM4, support for: AMD Ryzen™ 5000 G-Series Processors/ AMD Ryzen™ 5000 Series Processors/ AMD Ryzen™ 4000 G-Series Processors/ AMD Ryzen™ 30

NETWORK Technology GSM / CDMA / HSPA / EVDO / LTE / 5G LAUNCH Announced 2025, January 22 Status Available. Released 2025, February 03 BODY Dimensions 158.4 x 75.8 x 7.3 mm (6.24 x 2.98 x 0.

Network Technology GSM / HSPA / LTE Launch Announced 2024, October 15 Status Available. Released 2024, November 20 Body Dimensions 164.4 x 77.9 x 7.9 mm (6.47 x 3.07 x 0.31 in) Weight 200 g

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2025, September 04 Status Available. Released 2025, September 04 BODY Dimensions 161.3 x 76.6 x 7.4 mm (6.35 x 3.02 x 0.29 in) Weig

LAUNCH Announced 2024, September 26 Status Available. Released 2024, October 03 BODY Dimensions 285.4 x 185.4 x 5.6 mm (11.24 x 7.30 x 0.22 in) Weight 571 g (Wi-Fi), 576 g (5G) (1.26 lb) Bui

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2025, September 18 Status Available. Released 2025, September 18 BODY Dimensions 164.4 x 77.9 x 7.5 mm (6.47 x 3.07 x 0.30 in) Weight 19

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2025, August 25 Status Available. Released 2025, August 25 BODY Dimensions 167.4 x 77.4 x 7.6 mm (6.59 x 3.05 x 0.30 in) Weight 184 g (6

LAUNCH Announced 2024, September 26 Status Available. Released 2024, October 03 BODY Dimensions 326.4 x 208.6 x 5.4 mm (12.85 x 8.21 x 0.21 in) Weight 718 g (Wi-Fi), 723 g (5G) (1.58 lb) Bui

La marque VEVSHAO propose le mini projecteur V30 Display Type : Texas Instruments Ti DLP technology Display Chip : Ti 0.23 inch DMD (with off-axis 100% optical machine) Brightness : 400ANSI

Pour vos besoin en produit Arduino  le kit avancé est un kit complet comprenant tout les composants de base pour vos experiences en programmation et électroniques. Le kit comprends :

AMD B450 mATX gaming motherboard with Aura Sync RGB LED lighting, DDR4 4400MHz support, 32Gbps M.2, HDMI 2.0b, Type C and native USB 3.1 Gen 2. Fan Xpert 2+: Ensures every fan achieves t

AMD B450 mATX gaming motherboard with Aura Sync RGB LED lighting, DDR4 4400MHz support, Dual M.2, and native USB 3.1 Gen 2. Realtek S1200A Codec: Features an unprecedented 108dB signal-to