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Imprimante Transfert thermique Pour etiquettes GODEX EZ120 EQUI G500 Bureautique Tres Robuste Made in taiwan Taille d'impression max 108mm. Ruban 350m. Fiche technique Model EZ120 Print

✅INFORMATIONS GÉNÉRALES : ✅Désignation : SANDISK ULTRA DUAL DRIVE GO - 128GB - FLASH DISQUE USB TYPE-A & USB TYPE-C - 400 MBS - ORIGINAL ✅Marque : SANDISK ✅Modèle : SDDDC3-128G-G

✅INFORMATIONS GÉNÉRALES : ✅Désignation : Gigabyte Z790 AORUS ELITE ✅Marque : Gigabyte ✅Modèle : Z790 AORUS ELITE ✅ Processeur : LGA1700 socket: Support for the 13th and 12th G

✅INFORMATIONS GÉNÉRALES : ✅Désignation : SANDISK ULTRA DUAL DRIVE GO - 256GB - FLASH DISQUE USB TYPE-A & USB TYPE-C - 400 MBS - ORIGINAL ✅Marque : SANDISK ✅Modèle : SDDDC3-256G-

✅INFORMATIONS GÉNÉRALES : ✅Désignation : Sandisk ✅Marque : Sandisk ✅Modèle : SDCZ600-016G-G35 ✅SPÉCIFICATIONS TECHNIQUES ET DÉTAILS : Type: Flash Memory Drive Capacity: 1

⚡ Tous les produits Siemens sont disponibles sur commande ⚡ Vous recherchez du matériel industriel original Siemens ? Nous vous proposons la fourniture sur commande de toute la gamme S

SSD capacity: 512 GB RAID support: Yes Data transfer rate: 6 Gbit/s ECC: Yes Interface: Serial ATA III S.M.A.R.T. support: Yes Sequential read speed (ATTO): 560 MB/s Sequential write speed (

✅INFORMATIONS GÉNÉRALES : ✅Désignation : SANDISK ULTRA DUAL DRIVE GO - 256GB - FLASH DISQUE USB TYPE-A & USB TYPE-C - 400 MBS - ORIGINAL ✅Marque : SANDISK ✅Modèle : SDDDC3-256G-G

✅INFORMATIONS GÉNÉRALES : ✅Désignation : SANDISK ULTRA DUAL DRIVE GO - 128GB - FLASH DISQUE USB TYPE-A & USB TYPE-C - 400 MBS - ORIGINAL ✅Marque : SANDISK ✅Modèle : SDDDC3-128G-G

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2023, November 21 Status Available. Released 2023, December 07 BODY Dimensions 163.7 x 75.6 x 8.6 mm (6.44 x 2.98 x 0.34 in) Weight - Bu

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2024, April 04 Status Available. Released 2024, May BODY Dimensions 166.2 x 76.8 x 7.9 mm (6.54 x 3.02 x 0.31 in) Weight 195 g (6.88 oz)

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2025, September 04 Status Available. Released 2025, September 04 BODY Dimensions 161.3 x 76.6 x 7.4 mm (6.35 x 3.02 x 0.29 in) Weig

LAUNCH Announced 2024, September 26 Status Available. Released 2024, October 03 BODY Dimensions 326.4 x 208.6 x 5.4 mm (12.85 x 8.21 x 0.21 in) Weight 718 g (Wi-Fi), 723 g (5G) (1.58 lb) Bui

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2025, August 25 Status Available. Released 2025, August 25 BODY Dimensions 167.4 x 77.4 x 7.6 mm (6.59 x 3.05 x 0.30 in) Weight 184 g (6

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2024, October 15 Status Available. Released 2024, November 20 BODY Dimensions 164.4 x 77.9 x 7.9 mm (6.47 x 3.07 x 0.31 in) Weight 200 g

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2025, March 02 Status Available. Released 2025, March 19 BODY Dimensions 164 x 77.5 x 7.7 mm (6.46 x 3.05 x 0.30 in) Weight 200 g (

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2025, February 27 Status Available. Released 2025, March 05 BODY Dimensions 164.4 x 77.9 x 7.9 mm (6.47 x 3.07 x 0.31 in) Weight 19

Network Technology GSM / HSPA / LTE / 5G Launch Announced 2025, March 02 Status Available. Released 2025, March 10 Body Dimensions 162.9 x 78.2 x 7.4 mm (6.41 x 3.08 x 0.29 in) Weight 195 g

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2025, September 18 Status Available. Released 2025, September 18 BODY Dimensions 164.4 x 77.9 x 7.5 mm (6.47 x 3.07 x 0.30 in) Weight 19

✅INFORMATIONS GÉNÉRALES : ✅Désignation : SAMSUNG Galaxy A56 5G Ai (128GB + 8GB) 6.6" 120Hz 50MP Triple (Awesome LightGray ) ✅Marque : SAMSUNG ✅Modèle : SM-A566E/DS ✅ Network T

Brand LINGDU Model name LD02-Lite Vehicle service type Car Connectivity technology Wi-Fi Special features Built-In Supercapacitor, Built‒In 5G Wi-Fi/GPS, Time-lapse, Voice Control, WDR Inc

AMD Socket AM5：Supports AMD Ryzen™ 7000 / Ryzen™ 8000 Series Processors Unparalleled Performance：Twin 12+2+2 Phases Digital VRM Solution Dual Channel DDR5：4*DIMMs with AMD EXPO™

Users / Card Capacity : 60,000 (Standard), 100,000 (Optional) Transaction Capacity :600,000 Communication : TCP / IP / RS232 / RS485* / Wiegand Input / Output / Security Relay Box Access

EN STOCK Livraison Gratuite 58W rand ASUS Model ROG STRIX X870E-H GAMING WIFI7 Supported CPU CPU Socket Type AM5 CPU Type Ryzen 7000 Series / Ryzen 8000 Series / Ryzen 9000 Series Chipse

Chipset INTEL Z890 CPU Supports Intel® Core™ Ultra Processors (Series 2) LGA 1851 Memory 4x DDR5 UDIMM, Maximum Memory Capacity 256GB Memory Support 9200 - 6400 (OC) MT/s / 6400 - 4800 (J

Network Technology GSM / HSPA / LTE Launch Announced 2023, November 10 Status Available. Released 2023, November 10 Body Dimensions 168 x 78 x 8.1 mm (6.61 x 3.07 x 0.32 in) Weight 192 g (6

Network Technology GSM / HSPA / LTE Launch Announced 2024, August 30 Status Available. Released 2024, August 30 Body Dimensions 171.9 x 77.8 x 8.2 mm (6.77 x 3.06 x 0.32 in) Weight 204 / 20

Network Technology GSM / HSPA / LTE Launch Announced 2024, May 24 Status Available. Released 2024, May 24 Body Dimensions 168.4 x 76.3 x 8.3 mm (6.63 x 3.00 x 0.33 in) Weight 193 g (6.81 oz

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2024, August 30 Status Available. Released 2024, August 30 BODY Dimensions 171.9 x 77.8 x 8.2 mm (6.77 x 3.06 x 0.32 in) Weight 204 / 20

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2025, March 21 Status Available. Released 2025, March 21 BODY Dimensions 171.7 x 77.8 x 8.3 mm (6.76 x 3.06 x 0.33 in) Weight 193 g (6.8