▪️طقم سبينات يحتوي على أربع منتجات : سبينات ستيكر، سبينات حاملة المفاتيح، بطاقة سبينات، سبينات الخاصة بالم

Processeur AMD Socket AM5, support for: AMD Ryzen™ 7000 / Ryzen™ 8000 / Ryzen™ 9000 Series Processors (Go to GIGABYTE's website for the latest CPU support list.) Chipset AMD B650 Mém

✅INFORMATIONS GÉNÉRALES : ✅Désignation : Esonic Motherboard H61-FHL ✅Marque : Esonic ✅Modèle : H61-FHL ✅Motherboard Model: H61-FHL ✅Support Memory Type: DDR3(1066/1366/16

CBC vous propose pour les industriels et tout segment d'activité qui requiert une robustesse et une qualité exigé , nos pc industrielle specialement concus pour vos besoin selon les confi

PERFORMANCE Processor Intel® Core™ i3-1315U, 6C (2P + 4E) / 8T, P-core 1.2 / 4.5GHz, E-core 0.9 / 3.3GHz, 10MB Graphics Integrated Intel® UHD Graphics Chipset Intel® SoC Platform Memory

✅INFORMATIONS GÉNÉRALES : ✅Désignation : Esonic Motherboard H61-FHL ✅Marque : Esonic ✅Modèle : H61-FHL ✅Motherboard Model: H61-FHL ✅Support Memory Type: DDR3(1066/1366/1600

🔹🔹LENOVO THINKPAD L14 GEN-6 2025🔹🔹 PRODUIT NEUF JAMAIS UTILISE 🔹CPU: AMD Ryzen™ RYZEN 7 PRO 250w (Ultra7-155H) 3,30 GHz jusqu'à 5,10 GHz 🔹RAM: 16 Go DDR5 5600MHZ 🔹S

✅INFORMATIONS GÉNÉRALES : ✅Désignation : REDMI NOTE 14 - 8GO - 256GO - DUAL SIM - 6,6" AMOLED - 108 MPXL - 5500 MAH ✅Marque : REDMI ✅Modèle : REDMI NOTE 14 ✅Smartphone Redmi N

Network Technology GSM / HSPA / LTE Launch Announced 2024, May 24 Status Available. Released 2024, May 24 Body Dimensions 168.4 x 76.3 x 8.3 mm (6.63 x 3.00 x 0.33 in) Weight 193 g (6.81 oz

Network Technology GSM / HSPA / LTE Launch Announced 2023, November 10 Status Available. Released 2023, November 10 Body Dimensions 168 x 78 x 8.1 mm (6.61 x 3.07 x 0.32 in) Weight 192 g (6

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2024, August 30 Status Available. Released 2024, August 30 BODY Dimensions 171.9 x 77.8 x 8.2 mm (6.77 x 3.06 x 0.32 in) Weight 204 / 20

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2024, August 30 Status Available. Released 2024, August 30 BODY Dimensions 171.9 x 77.8 x 8.2 mm (6.77 x 3.06 x 0.32 in) Weight 204 / 20

Processor: 3.0 GHz or 3.4 GHz Intel Core i5 (7th Gen)Memory (RAM): 8 GB 2400 MHz DDR4 onboard (upgradable at time of purchase)Storage: 1 TB 5400 RPM HDD or Fusion DriveDisplay: 21.5-inch Ret

Découvrez plus de produits sur notre site internet Résumé L'architecture AMD RDNA™ 4 est élevée par un refroidissement et une alimentation améliorés pour débiter sans effort des

Résumé L’architecture RDNA™ 4 d’AMD rehaussée par un refroidissement et une puissance améliorés pour produire sans effort des images en résolution 4K et au-delà, et soutenue par

Nouveau Extensions RAM & SSD disponible sur consultation ✅Processeur : Intel Core i5-1335U (12 MB cache, 10 cores (2 P cores & 8 E cores), 12 threads, P cores 1.30 GHz to 4.60 GHz,

Nouveau Extensions RAM & SSD disponible sur consultation ✅Processeur : Intel Core i7-1355U (12 MB cache, 10 cores (2 P cores & 8 E cores), 12 threads, P cores 1.70 GHz to 5.00 GHz,

NETWORK Technology No cellular connectivity LAUNCH Announced 2023, May 10 Status Available. Released 2023, June 20 BODY Dimensions 258 x 169 x 8.1 mm (10.16 x 6.65 x 0.32 in) Weight 493 g (

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2024, January 10 Status Available. Released 2024, January 23 BODY Dimensions 169 x 80.1 x 10.2 mm (6.65 x 3.15 x 0.40 in) Weight 24

LAUNCH Announced 2024, September 26 Status Available. Released 2024, October 03 BODY Dimensions 326.4 x 208.6 x 5.4 mm (12.85 x 8.21 x 0.21 in) Weight 718 g (Wi-Fi), 723 g (5G) (1.58 lb) Bui

LAUNCH Announced 2024, September 26 Status Available. Released 2024, October 03 BODY Dimensions 285.4 x 185.4 x 5.6 mm (11.24 x 7.30 x 0.22 in) Weight 571 g (Wi-Fi), 576 g (5G) (1.26 lb) Bui

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2025, September 18 Status Available. Released 2025, September 18 BODY Dimensions 164.4 x 77.9 x 7.5 mm (6.47 x 3.07 x 0.30 in) Weight 19

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2025, June 27 Status Available. Released 2025, July 12 BODY Dimensions 164.4 x 77.9 x 7.7 mm (6.47 x 3.07 x 0.30 in) Weight 197 g (

Network Technology GSM / HSPA / LTE / 5G Launch Announced 2025, March 02 Status Available. Released 2025, March 10 Body Dimensions 162.9 x 78.2 x 7.4 mm (6.41 x 3.08 x 0.29 in) Weight 195 g

NETWORK Technology GSM / CDMA / HSPA / EVDO / LTE / 5G LAUNCH Announced 2025, January 22 Status Available. Released 2025, February 03 BODY Dimensions 158.4 x 75.8 x 7.3 mm (6.24 x 2.98 x 0.

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2025, September 04 Status Available. Released 2025, September 04 BODY Dimensions 161.3 x 76.6 x 7.4 mm (6.35 x 3.02 x 0.29 in) Weig

Nouveau Extensions RAM & SSD disponible sur consultation ✅Processeur : Intel Core i3-1305U (10 MB cache ,5 cores (1 P cores & 4 E cores), 6 threads, P cores 1.60 GHz to 4.50 GHz, E

AMD Socket AM5：Supports AMD Ryzen™ 9000 / 8000 / 7000 Series Processors Digital twin 16+2+2 phases VRM solution Dual Channel DDR5：4*DIMMs with AMD EXPO™ Memory Module Support WIFI EZ

✅INFORMATIONS GÉNÉRALES : ✅Désignation : SAMSUNG Galaxy A56 5G Ai (128GB + 8GB) 6.6" 120Hz 50MP Triple (Awesome LightGray ) ✅Marque : SAMSUNG ✅Modèle : SM-A566E/DS ✅ Network T

Launch Announced 2021, May 19 Status Available. Released 2021, June Body Dimensions 244 x 153 x 8.2 mm (9.61 x 6.02 x 0.32 in) Weight 460 g (1.01 lb) SIM Nano-SIM Display Type IPS LCD, 330

CPU INTEL G630 / RAM 4GB / PSU 460WATTS / HDD 1TB NOTE: For the Standard Features shipped in the "Factory Integrated Models", please see the "Configuration Information - Factory Integrate