يسرّنا الإعلان عن مشاركة MendaciumTech ضمن قائمة الشركات الناشئة العارضة في Webexpo ElDjazair Startup متخصصة في تطوير حلول ويب �

EN Stock Livraison Gratuite 58w 27-inch monitor with WQHD 2560 x 1440 (16:9) resolution Fast IPS panel : fast response time (1ms), rich and accurate colours and wide viewing angles (178°

HP DL380 G9 CPU XEON 2X 2609 V3 RAM 32GB PSU 2X 500WATTS HDD 7X 500GB HP ProLiant DL580 Gen7 Traditionally, mission-critical RAS (Reliability, Availability and Serviceability) fe

2 IN 1 MHHX SUPPORT: The MHHX from Mars Gaming offers a 2-in-1 system: headset and hub holder with 2 USB 2.0 ports; Equipped with an LED RGB flow strip, the MHHX is a professional accessory

✅Tous nos produits sont neufs, jamais utilisés et livrés dans leur emballage d’origine scellé✅ ➡️➡️ البيع فقط عن طريق التوصيل ،للطلب اضغط ع�

CPU XEON 2X 2609 V3 RAM 32GB PSU 2X 500WATTS HDD 7X 500GB HP ProLiant DL580 Gen7 Traditionally, mission-critical RAS (Reliability, Availability and Serviceability) features have been ass

CARACTERISTIQUES : LED display. Microprocessor-based digital control. Boost and buck AVR for voltage stabilization. Auto sensing frequency. Wide input voltage range. Power-on self test. Cold

🎙️ ميكروفون احترافي للبث وصناعة المحتوى – HyperX SoloCast ميكروفون HyperX SoloCast مصمم للاعبين وصناع المحتوى والبو

CARACTERISTIQUES : LED display. Microprocessor-based digital control. Boost and buck AVR for voltage stabilization. Auto sensing frequency. Wide input voltage range. Power-on self test. Cold

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2025, September 24 Status Available. Released 2025, September 24 BODY Dimensions 162.7 x 77.9 x 8 mm (6.41 x 3.07 x 0.31 in) Weight

✅INFORMATIONS GÉNÉRALES : ✅Désignation : LENOVO V15 G2 IJL - INTEL Core I3-1315U - 8GB - 256 SSD - 15.6" FHD - UHD GRAPHICS - AZERTY - BLACK ✅Marque : LENOVO ✅Modèle : 83A1004SFE

MAXHUB Smart Poduim State-of-the-art Smart Lectern, packed with innovative features to enhance your presentations. With full lamination technology and active capacitive touch technology. T

AMD Socket AM5, support for: AMD Ryzen™ 7000 / Ryzen™ 8000 / Ryzen™ 9000 Series Processors (Go to GIGABYTE's website for the latest CPU support list.) Chipset AMD B650 Mémoire Support

Pour vos besoin en produit Arduino  le kit avancé est un kit complet comprenant tout les composants de base pour vos experiences en programmation et électroniques. Le kit comprends :

CPU XEON 4X E7520 RAM 32GB PSU 4X 1200WATTS GRAVEUR DVD HDD 8X 500GB HP ProLiant DL580 Gen7 Traditionally, mission-critical RAS (Reliability, Availability and Serviceability) features h

iBoard Ecran tactile interactif 65 pouces Caractéristiques : DISPLAY Screen Type TFT LED Display Ratio 16:9 Display Area 1428.5*803.5 mm(64.53 inch) View Angle 178° Resolut

Dispose de carte de development Arduino , uno , mega , nano , due ,ADK , promini   ou en kit Senseurs humudité de temperature  ...etc.. , shield  ,servo moteur , moteur pas a pas , rasp

CONVERTISEUR 4K HDMI/SDI DECIMATOR 12G-CROSS Points Forts du produit Entrée jusqu'à 4K HDMI et 12G-SDI Convertit HDMI en SDI et SDI en HDMI 1 x entrée HDMI, 1 x sortie HDMI Prend en char

Model TUF GAMING B650-PLUS CPU AMD Socket AM5 for AMD Ryzen™ 9000 & 8000 & 7000 Series Desktop Processors* * Refer to for CPU support list. Chipset AMD B650 Mémoire 4 x DIMM, Max. 256GB,

MOTHERBOARD AMD AM5 ASUS ROG STRIX X870E-H GAMING WIFI7 DDR5 Ready for Advanced AI PC: Designed for the future of AI computing, with the power and connectivity needed for demanding AI appli

Processeur AMD Socket AM5, support for: AMD Ryzen™ 7000 / Ryzen™ 8000 / Ryzen™ 9000 Series Processors (Go to GIGABYTE's website for the latest CPU support list.) Chipset AMD B650 Mém

La marque VEVSHAO propose le mini projecteur V30 Display Type : Texas Instruments Ti DLP technology Display Chip : Ti 0.23 inch DMD (with off-axis 100% optical machine) Brightness : 400ANSI

LAUNCH Announced 2024, September 26 Status Available. Released 2024, October 03 BODY Dimensions 285.4 x 185.4 x 5.6 mm (11.24 x 7.30 x 0.22 in) Weight 571 g (Wi-Fi), 576 g (5G) (1.26 lb) Bui

LAUNCH Announced 2024, September 26 Status Available. Released 2024, October 03 BODY Dimensions 285.4 x 185.4 x 5.6 mm (11.24 x 7.30 x 0.22 in) Weight 571 g (Wi-Fi), 576 g (5G) (1.26 lb) Bui

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2025, August 25 Status Available. Released 2025, August 25 BODY Dimensions 167.4 x 77.4 x 7.6 mm (6.59 x 3.05 x 0.30 in) Weight 184 g (6

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2025, September 18 Status Available. Released 2025, September 18 BODY Dimensions 164.4 x 77.9 x 7.5 mm (6.47 x 3.07 x 0.30 in) Weight 19

LAUNCH Announced 2024, September 26 Status Available. Released 2024, October 03 BODY Dimensions 326.4 x 208.6 x 5.4 mm (12.85 x 8.21 x 0.21 in) Weight 718 g (Wi-Fi), 723 g (5G) (1.58 lb) Bui

NETWORK Technology GSM / CDMA / HSPA / EVDO / LTE / 5G LAUNCH Announced 2024, January 17 Status Available. Released 2024, January 24 BODY Dimensions 162.3 x 79 x 8.6 mm (6.39 x 3.11 x 0.34

NETWORK Technology GSM / CDMA / HSPA / EVDO / LTE / 5G LAUNCH Announced 2025, January 22 Status Available. Released 2025, February 03 BODY Dimensions 158.4 x 75.8 x 7.3 mm (6.24 x 2.98 x 0.

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2025, February 27 Status Available. Released 2025, March 05 BODY Dimensions 164.4 x 77.9 x 7.9 mm (6.47 x 3.07 x 0.31 in) Weight 19

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2025, September 04 Status Available. Released 2025, September 04 BODY Dimensions 161.3 x 76.6 x 7.4 mm (6.35 x 3.02 x 0.29 in) Weig