Ryzen 7000 READY, HIGH PERFORMANCE - The MAG X670E TOMAHAWK WIFI (ATX) employs a 14+2 Duet Rail VRM with 80A SPS VRM for the AMD X670 chipset (AM5, Ryzen 7000 ready); Core Boost for enhanced

Unique Feature Superb Productivity - PCIe Gen5 (Graphics, M.2) - Dual Channel DDR5 Rock-Solid Durability - 12+2+1 Power Phase, Dr.MOS for VCore+SOC+MISC with Enlarged Heatsink Armor - Flexib

VRM PUISSANT, Ryzen 9000 Ready - La PRO B650-S WIFI utilise un VRM double rail à 12 phases (P-PAK) pour le chipset AMD B650 (AM5, pour Ryzen 7000 à 9000). Le VRM est doté de la technologi

Unique Feature Superb Productivity - PCIe Gen5 (Graphics, M.2) - Dual Channel DDR5 Rock-Solid Durability - 16+1+1 Power Phase, 60A SPS for VCore+GT - Flexible Integrated I/O Shield - Nichico

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Cool for R7 | i7: Four heat pipes and a silver nickel-plated copper base ensure optimal cooling performance for AMD R7 and *Intel i7. Spectrum Fan: Experience premium airflow with cooling wi

ARGB Auto DETECTION-Intuitive LED detection automatically provides default ARGB spectrum lighting or full ARGB customization via 3-pin header connection. Spectrum ARGB Fan Performance Spectr

Unique Feature Superb Productivity – Dual Channel DDR5 Rock-Solid Durability – 7+1+1 Power Phase – ASRock Intel® 4-Layer Memory POOL (Planes on Outer Layers) Technology Ultrafast Conn

Unique Feature Superb Productivity – PCIe Gen5 (Graphics, M.2) – Dual Channel DDR5 – Thunderbolt™ 4 Type-C Port (40 Gb/s) Rock-Solid Durability – 16+1+1+1+1 Power Phase, Dr. MOS fo

Unique Feature Superb Productivity – PCIe Gen5 (M.2) – Dual Channel DDR5 Rock-Solid Durability – 8+2+1 Power Phase, 50A Dr.MOS – Pre-Installed I/O Shield Ultrafast Gaming – 2.5G LA

RYZEN 9000 READY - La B650M GAMING PLUS WIFI est une carte mère Micro-ATX compacte équipée du chipset AMD B650 (AM5, Ryzen 9000, 8000 & 7000) ; le VRM dispose de la technologie MSI Core B

Unique Feature Superb Productivity - PCIe Gen5 (Graphics, M.2) - Dual Channel DDR5 Rock-Solid Durability - 14+2+1 Power Phase, 80A Dr.MOS for VCore+SOC+MISC with Enlarged Heatsink Armor - Fl

H61H2-M13 / état 9.5/10 CPU / معالج جينيراسيوا 2000/3000 i3 gen2 /i3 gen3 I5 gen2 / i5gen3 I7 gen2 / i7 gen3 Condensateur solide pour la face du Prend en charge la technolog

CPU Intel® Socket LGA1700 for 13th Gen Intel® Core™ & 12th Gen Intel® Core™, Pentium® Gold and Celeron® Processors Supports Intel® Turbo Boost Technology 2.0 and Intel® Turbo Boo

Unique Feature Rock-Solid Durability - 7+1+1 Power Phase, 50A Dr.MOS for VCore+GT - Pre-Installed I/O Shield - ASRock Intel® 4-Layer Memory POOL (Planes on Outer Layers) Technology Ultrafas