programmateur Postal3_AVR fonctionne par USB- sur Windows 7-10-11 Lecture fichier HEX-BINNAIRE -EEPROM- BIOS- EPROM- AVR- ATTINY- BOOTLOADER -Micronas, MStar et KV Fiche technique 25Q16; W25Q1

Téléviseur Raylan Gaming – Optimisé pour les Gamers Le TV Raylan Gaming est spécialement conçu pour les passionnés de jeux vidéo qui recherchent une performance visuelle et sonore e

Téléviseur Raylan Gaming – Optimisé pour les Gamers Le TV Raylan Gaming est spécialement conçu pour les passionnés de jeux vidéo qui recherchent une performance visuelle et sonore e

CPU XEON 2X 2609 V3 RAM 32GB PSU 2X 500WATTS HDD 7X 500GB HP ProLiant DL580 Gen7 Traditionally, mission-critical RAS (Reliability, Availability and Serviceability) features have been ass

✅Chipset Intel H610 ✅CPU SUPPORT Support for 12th/ 13th Generation Intel Core™ i9/ i7/ i5/ i3 processors and Intel Pentium processors/ Intel Celeron processors in the LGA1700 package *

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Specifications Operating System Windows 11 Home Processor Family Intel® Core™ Ultra 7 Processor Intel® Core™ Ultra 7 255U (up to 5.2 GHz, 12 MB L3 cache, 12 cores / 14 threads) Chipse

CPU INTEL G630 / RAM 4GB / PSU 460WATTS / HDD 1TB NOTE: For the Standard Features shipped in the "Factory Integrated Models", please see the "Configuration Information - Factory Integrate

HP Elite Tower 800 G9 Desktop PC (5L250EA) + ECRAN HP V22v G5 21.45" FHD (1920 x 1080 @ 75 Hz) FreeSync, L blue light Operating system FreeDOS Processor family 12th Generation Intel® Cor

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NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2023, November 21 Status Available. Released 2023, December 07 BODY Dimensions 163.7 x 75.6 x 8.6 mm (6.44 x 2.98 x 0.34 in) Weight - Bu

iBoard Ecran tactile interactif 65 pouces Caractéristiques : DISPLAY Screen Type TFT LED Display Ratio 16:9 Display Area 1428.5*803.5 mm(64.53 inch) View Angle 178° Resolut

LAUNCH Announced 2024, September 26 Status Available. Released 2024, October 03 BODY Dimensions 326.4 x 208.6 x 5.4 mm (12.85 x 8.21 x 0.21 in) Weight 718 g (Wi-Fi), 723 g (5G) (1.58 lb) Bui

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2025, September 04 Status Available. Released 2025, September 04 BODY Dimensions 161.3 x 76.6 x 7.4 mm (6.35 x 3.02 x 0.29 in) Weig

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2025, February 27 Status Available. Released 2025, March 05 BODY Dimensions 164.4 x 77.9 x 7.9 mm (6.47 x 3.07 x 0.31 in) Weight 19

LAUNCH Announced 2025, August 25 Status Available. Released 2025, August 25 BODY Dimensions 254.3 x 165.8 x 6.6 mm (10.01 x 6.53 x 0.26 in) Weight 524 g (1.16 lb) Build Glass front, aluminum

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2025, August 25 Status Available. Released 2025, August 25 BODY Dimensions 167.4 x 77.4 x 7.6 mm (6.59 x 3.05 x 0.30 in) Weight 184 g (6

Network Technology GSM / HSPA / LTE / 5G Launch Announced 2025, March 02 Status Available. Released 2025, March 10 Body Dimensions 162.9 x 78.2 x 7.4 mm (6.41 x 3.08 x 0.29 in) Weight 195 g

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2025, March 02 Status Available. Released 2025, March 19 BODY Dimensions 164 x 77.5 x 7.7 mm (6.46 x 3.05 x 0.30 in) Weight 200 g (

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2024, October 15 Status Available. Released 2024, November 20 BODY Dimensions 164.4 x 77.9 x 7.9 mm (6.47 x 3.07 x 0.31 in) Weight 200 g

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2025, September 18 Status Available. Released 2025, September 18 BODY Dimensions 164.4 x 77.9 x 7.5 mm (6.47 x 3.07 x 0.30 in) Weight 19

✅INFORMATIONS GÉNÉRALES : ✅Désignation : SAMSUNG Galaxy A56 5G Ai (128GB + 8GB) 6.6" 120Hz 50MP Triple (Awesome LightGray ) ✅Marque : SAMSUNG ✅Modèle : SM-A566E/DS ✅ Network T

Spécifications Capacity 2 To Interface USB 3.2 Gen 2 Dimensions (L x l x H) 100.8mm x 52.55mm x 9.6mm Compatibilité USB Type-C devices (phones, laptops, and tablets) iOS 13+ Android 11+ ma

AMD Socket AM5：Supports AMD Ryzen™ 7000 / Ryzen™ 8000 Series Processors Unparalleled Performance：Twin 12+2+2 Phases Digital VRM Solution Dual Channel DDR5：4*DIMMs with AMD EXPO™

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Intel LGA 1700 socket: Ready for Intel Core 14th & 13th Gen Processors, Intel Core 12th Gen, Pentium Gold and Celeron Processors Enhanced power solution: 14+1 DrMOS, 6-layer PCB, ProCool con

In terms of specifications, the Galaxy F07 aims to provide essential features suited for everyday use. It is rumored to include IP54 dust and splash resistance in certain markets, offering a

CPU XEON 4X E7520 RAM 32GB PSU 4X 1200WATTS GRAVEUR DVD HDD 8X 500GB HP ProLiant DL580 Gen7 Traditionally, mission-critical RAS (Reliability, Availability and Serviceability) features h

EN STOCK Livraison Gratuite 58W rand ASUS Model ROG STRIX X870E-H GAMING WIFI7 Supported CPU CPU Socket Type AM5 CPU Type Ryzen 7000 Series / Ryzen 8000 Series / Ryzen 9000 Series Chipse